ALEXANDRIA, Va., July 7 -- United States Patent no. 12,677,389, issued on July 7, was assigned to HITACHI ASTEMO LTD. (Hitachinaka, Japan). "In-vehicle device" was invented by Kimihito Watanabe (Hita... Read More
ALEXANDRIA, Va., July 7 -- United States Patent no. 12,677,390, issued on July 7, was assigned to Quanta Computer Inc. (Taoyuan City, Taiwan). "Toolless latch for securing a component module" was inv... Read More
ALEXANDRIA, Va., July 7 -- United States Patent no. 12,677,391, issued on July 7, was assigned to Quanta Computer Inc. (Taoyuan City, Taiwan). "External button control system" was invented by Le-Shen... Read More
ALEXANDRIA, Va., July 7 -- United States Patent no. 12,677,392, issued on July 7, was assigned to Dell Products LP (Round Rock, Texas). "Autonomous environmental monitoring device" was invented by Ne... Read More
ALEXANDRIA, Va., July 7 -- United States Patent no. 12,677,393, issued on July 7, was assigned to PLUME DESIGN INC. (Palo Alto, Calif.). "Fan assembly" was invented by Ming-Tsung Su (Taipei City, Tai... Read More
ALEXANDRIA, Va., July 7 -- United States Patent no. 12,677,394, issued on July 7, was assigned to Fulian Precision Electronics (Tianjin) Co. LTD. (Tianjin, China). "Isolation device for isolating lea... Read More
ALEXANDRIA, Va., July 7 -- United States Patent no. 12,677,395, issued on July 7, was assigned to ANI Acquisition Sub LLC (Boca Raton, Fla.). "Heat exchanger and small cell radio node incorporating t... Read More
ALEXANDRIA, Va., July 7 -- United States Patent no. 12,677,396, issued on July 7, was assigned to International Business Machines Corp. (Armonk, N.Y.). "Heatsink with phase changing plugs and extingu... Read More
ALEXANDRIA, Va., July 7 -- United States Patent no. 12,677,397, issued on July 7, was assigned to Aptiv Technologies AG (Schaffhausen, Switzerland). "Cooling system for a wireless power transmitter a... Read More
ALEXANDRIA, Va., July 7 -- United States Patent no. 12,677,398, issued on July 7, was assigned to Dell Products LP (Round Rock, Texas). "System and method for thermal management of hardware component... Read More